Hot Candidates FABRICATION General Management (Ref # GM 1): BS-Industrial Engineering. Nineteen years of progressive experience in the printed circuit board industry. Has spent thirteen years inside board shops initiating his career in production control and planning, process engineering, and culminating as VP-Operations for a $45M/400 employee operation. Has continued in the industry, in operations, on the supply side holding multi-plant/multi-national responsibilities for a major supplier of drilling tools. Engineering Management/Manufacturing Management (Ref # EM 1): MBA & BS-Chemical Engineering. Fifteen years in the field of printed circuit board fabrication. Has held technical responsibilities in all areas of wet and dry processing in high tech product environments. Has managed process engineering activities in support of daily production efforts as well as developmental engineering. Knowledgeable in equipment and materials. (Ref # EM 2): Thirteen years technical experience in the field of printed circuit board fabrication. Strengths throughout the entire fabrication cycle from pre-production, image processing, DES, lamination, drilling, etc. Has managed technical teams of up to 13 process engineers. Presently holds unit management responsibilities in a high volume production operation encompassing both manufacturing and engineering management responsibilities. Territory Sales-PCB, Flex and Material Supplies (Ref # PCS 1): BS-Mechanical Engineering Cornell University. A fast track career minded professional skilled in Interconnection Sales and Sales Support activities. Has sold Flexible Circuits, Value Added Electronic Assemblies and Materials to several high technology accounts. Performs direct selling and he has provided guidance to junior sales folks. Good track record of growing sales. Brings excellent technical knowledge of the industry. Territory Sales - Commodity Supplies (Ref # CS 1): MS-Systems Management. BS-Metallurgical Engineering/Materials Science. Extensive career history in technical sales of materials and specialty chemicals within the printed circuit board industry. Has managed key sales territories for some of the largest and most respected names on the supply side of the industry. Process Engineering - Fabrication (Ref # PEF 1): MS-Materials Science & BS-Chemical Engineering. Extensive career history in materials development and processing. Has been involved in printed circuit board laminate for the past ten years at a major OEM benchmarking and evaluating various HDI technologies, materials, processes, and suppliers. Additional PCB strengths in Direct Metallization technologies. Process Engineering - SMT /Product Engineering - SMT Capital Equipment (Ref # SMT 1): BS-Engineering/West Point. Strengths in product/applications engineering in SMT capital equipment manufacturing including all areas of hardware, software, and firmware support. Maintains international responsibilities for pre and post sales activities and on-going technical support. Additional strengths in SMT multiple line manufacturing as a process engineer, equipment/tooling/maintenance engineer and in operator training. Program Management-SMT/Microelectronics/OEM Products (Ref # SMT 2): BS-Engineering/RIT. Extensive experience in thick film microelectronics, RF, surface mount technology, automated manufacturing, and program and project management. Major strengths in process and product development, problem solving, customer interaction, and effective communication. Intuitive and strategic thinker with effective leadership, analytical, organizational and communication skills. (Ref # SMT 3): BS-Chemical Engineering, SUNY Buffalo. Technical experience in printed circuit board assembly and thin/thick film hybrid processing. Has performed in roles of process engineering and project and program management. Strengths in the areas of new product introduction, logistics, distribution, engineering, and materials. Currently manages materials and test. PCB Design and Applications (Ref #DES 1): Extensive technical experience in the printed circuit board industry. Strengths in CAD/CAM and AOI. Has held engineering technician positions inside board manufacturing as well as sales and applications engineering roles on the supply and service sides of the industry. Knowledgeable in both hardware and software support. Willing to travel as needed. Test Engineering ICT (Ref # test 1): MS- Electrical and Computer Engineering Oakland University Responsible for generating and supporting ICT test programs for new products, including fixture development and production on HP3070 and Teradyne platform. Knowledge of in-circuit test program, telecommunication equipment production testing, failure analysis and testability analysis on new products. (Ref # test 2): AS-Electronics Technology. Extensive experience writing software for test equipment and providing field support service to customer base. Skilled with In Circuit Test fixture programming as well as functional test. Skilled with Genrad hardware and software. Brings additional skills in Project and laboratory management. Contact one of our offices to discuss a candidate in detail or your own specific hiring need. General Management - Operations - Engineering Quality - Sales & Marketing - Supply Chain Copyright © 2001 - 2006 by Circuit-Search.com All rights reserved.